Electronics and power electronics cooling

Thermal simulation

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Electronics and power electronics cooling

The ongoing trend towards miniaturization of electronic components is offset by the compression of electrical energy in ever smaller spaces or areas. At the same time, as the switching frequencies increase, the power loss due to increased current flow also increases. This has an unfavorable effect on the operating temperature and thus on the failure rate of the electronic components and components. We support you in the context of thermal management in all matters relating to the packaging, heat dissipation and thermal dimensioning of your electronic devices and systems. For this we use the thermal simulation to exploit the optimization potential of your design. 

Some application examples:

  • Localization of hotspots, shadowing, air shortcuts
  • Design and dimensioning of cooling circuits
  • Coolers, heat exchangers and air conditioners
  • Pressure losses (device characteristic)
  • Fan integration and selection

The following physical properties are i.a. considered:

  • Heat conduction, convection and radiation
  • Transient currents
  • Turbulence
  • Joule heat